By Chris Schroeder
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Additional info for Printed circuit board design using AutoCAD
Sample text
This design rule is typically used for SMT boards in a wid e range of consumer and industrial products . 1 inch centers. 05 inch centers . Most PCB manufacturers can handle 8 mil traces . Dry film or liquid photoimageable resist materials are recommended ; 100% bare board electrical tes t is also highly recommended once production volumes are reached . 1 inch centers . Whe n traces are run between pads, the traces are offset 1/2 grid location for prope r centering and optimum spacing . This is shown more clearly in Figure 1-19 .
More accurate registration and thicker coatings are possible with dr y film than conventional screen printed solder mask. 003 inch have proven to be a disadvantage on fin e line/fine pitch SMT boards . Dry film solder mask has difficulty covering smal l areas between tightly spaced pads . In recent years dry film usage has declined, an d the trend is to use liquid photoimagable solder resist (LPISR) materials such as Ciba-Geigy's Probimer 52 . LPISR is recommended for all SMT boards . The use of solder mask was by no means universally accepted during the earl y days of the PCB industry .
Few electronics companies still maintain in-hous e board manufacturing capability . Most companies use multiple outside vendors . It is not unusual to find that a company uses one vendor for fast turn prototypes , another for fineline SMT boards, and an offshore source for high volum e production . Historical Overview of PCB Design Technique s The original techniques used for PCB design were borrowed from the graphic art s industry . In larger companies, the process involved several distinct disciplines , each of which was the realm of a different specialist .