By A. P. Manjunath, C. S. Rachana, S. Ranjini (auth.), V Sridhar, Holalu Seenappa Sheshadri, M C Padma (eds.)
PES collage of Engineering is organizing a world convention on rising study in Electronics, computing device technology and know-how (ICERECT-12) in Mandya and merging the development with Golden Jubilee of the Institute. The lawsuits of the convention provides top of the range, peer reviewed articles from the sector of Electronics, computing device technology and expertise. The ebook is a compilation of analysis papers from the state-of-the-art applied sciences and it truly is specified in the direction of the medical neighborhood actively inquisitive about study activities.
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Extra info for Emerging Research in Electronics, Computer Science and Technology: Proceedings of International Conference, ICERECT 2012
Example text
Special thanks are due to Ms. R. Nagarathna, STA ‘C’ for PCB layout design and Mr. Mahalingam, Scientist ‘F’, OIC, EMI/EMC, PCBD and PCBF groups, Mr. NA Boregowda, TO ‘B’, Mr. S. Vinod, STA ‘B’, and Mr. N. Vijaykumar, Tech ‘A’, for accurate and speedy fabrication of resistive FSS PCBs. References 1. Knott EF, Shaeffer JF, Tuley M (1993) Radar cross section. Artech House, USA 2. Munk BA (2000) Frequency selective surfaces—theory and design. Wiley, New York 3. Luo Y, Zhuang Y, Zhu S (2009) Thin and broadband Salisbury screen absorber using Minkowski fractal structure.
5 GHz. Measurements at other frequencies in the band are carried out for vertical polarization, and the results are available. RCS measurements at 3 GHz could not be carried out due to limitations in experimental setup. 5 Discussion of Results A three-layer RAM based on resistive fractal FSS for RCSR of -10 dBsm from 3 to 12 GHz described in this paper is designed with weight constraints. From RCS experiments, it is observed that the simulated and measured RCS results of RAM agree very well. This is attributed to the use of EP resistors, which have been modeled and fabricated with high accuracy.
6 Parametric simulation studies. Rout in the top layer only varying. 3. The PCB layout design and fabrication of embedded passives resistors is explained in detail in our earlier paper [6]. It is noted that six different values of resistors are required to be designed for a unit cell for the three FSS layers. This is enabled with the use of EP resistors. FR4 substrate of thickness 5 mil is used for fabrication of the EP resistor–based FSS PCBs. A commercially available thin film–based resistive sheet of value 250 X/sq.