By Charles Hamilton
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Additional info for A Guide to Printed Circuit Board Design
This will be bound to net any serious defects and will give the designer and the company concerned the confidence to proceed with large-quantity orders if so required. For method of generating CAD master patterns refer to Chapter 5. Other master artworks which may be required at the final stages of the board's development and prior to issuing for pilot production quantities are: Solder side resist master. Component side resist master. Legend/coding master. 46 A guide to printed circuit board design Solder side resist master The solder resist (ink) screen process is required on the solder side of the board primarily to prevent solder 'bridging' across adjacent conductors.
Therefore, on completion, each artwork should be housed in a suitable polythene envelope for subsequent storage and handling. Precision reduction photography can now be arranged and the prototype boards ordered (preferably from the same source). Apart from the artworks, all that is required to get the development boards on order is a flat-bed dyeline print of the solder side artwork marked up with the following information: (1) The hole table (showing hole codes, A, B, C,etc, and against each code the hole quantities, diameters, and whether plated or non-plated).
The master patterns now produced from the photo-plotter should conform exactly to the final Biro plot (except that the Biro plot will have been produced at the layout scale and the master pattern at 1:1). However, nothing can be left to chance and the master patterns will be subjected to the same stringent checking as applied to the Biro plot(s) earlier. The PCB designer will check specific pads, tracks and gaps for dimensional accuracy, using precision optical measuring scales. He will also check the register between the master patterns, and, where applicable, comparison checks should be carried out if there are any 1:1 reduced copies of taped master artworks available.